信步科技SV3b-72026嵌入式主板介绍
intel® kaby lake-u 7th gen core i5-7200u cpu at the solder side of m/b, with 6*com, 2*1000 mbps intel lan, 2*mini-pcie, 3.5'' (146*105mm)
intel® kaby lake-u 7th gen core i5-7200u cpu cpu at the solder side of m/b for fanless heat dissipation 6*com, 8*usb, 2*1000 mbps intel lan 2*mini-pcie (supports 1*msata, 1*wifi+3g/4g) supports triple display of vga, hdmi and lvds/edp 3.5'' (146*105mm)
规格 general
cpu intel® kaby lake-u coretm i5-7200u cpu, dual-core, up to 3.10ghz, tdp 15w
chipset null
memory up to 8 gb ddr3l 1600 mhz, 1*so-dimm
storage 1*sata 3.0, 1*msata
expansion interface 2*mini-pcie (1*msata supported, 1*wifi/3g/4g supported)
bios ami uefi bios
system windows 7/8/10, linux
i/o interface
serial port 6*rs232 (com6 rs485 optional)
usb 2*usb 3.0, 6*usb 2.0 (2*on rear i/o, 6*header)
ethernet 2*intel® pci-e lan for 1000mbps
audio realtek® alc662 5.1 channel hda codec, supports mic/line-outports
ps/2 1*ps/2 (keyboard and mouse supported)
parallel port null
gpio 8 programmable gpio
feature interface 1*svio connector
display
display interface 1*vga: max resolution up to 1920*1200
1*hdmi: max resolution up to 1920*1200
1*lvds/edp: dualchannel 24bit lvds, max resolution up to 1920*1200;
edp max resolution up to 1920*1080
multiple display triple
mechanical & environment
dimension 3.5'', 146*105mm
power input dc 9-28v
temperature operation: 0℃~60℃, storage: -25℃~75℃
relative humidity operation: 10%~90%, storage: 5%~95%, non-condensing
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intel® kaby lake-u 7th gen core i5-7200u cpu cpu at the solder side of m/b for fanless heat dissipation 6*com, 8*usb, 2*1000 mbps intel lan 2*mini-pcie (supports 1*msata, 1*wifi+3g/4g) supports triple display of vga, hdmi and lvds/edp 3.5'' (146*105mm)
规格 general
cpu intel® kaby lake-u coretm i5-7200u cpu, dual-core, up to 3.10ghz, tdp 15w
chipset null
memory up to 8 gb ddr3l 1600 mhz, 1*so-dimm
storage 1*sata 3.0, 1*msata
expansion interface 2*mini-pcie (1*msata supported, 1*wifi/3g/4g supported)
bios ami uefi bios
system windows 7/8/10, linux
i/o interface
serial port 6*rs232 (com6 rs485 optional)
usb 2*usb 3.0, 6*usb 2.0 (2*on rear i/o, 6*header)
ethernet 2*intel® pci-e lan for 1000mbps
audio realtek® alc662 5.1 channel hda codec, supports mic/line-outports
ps/2 1*ps/2 (keyboard and mouse supported)
parallel port null
gpio 8 programmable gpio
feature interface 1*svio connector
display
display interface 1*vga: max resolution up to 1920*1200
1*hdmi: max resolution up to 1920*1200
1*lvds/edp: dualchannel 24bit lvds, max resolution up to 1920*1200;
edp max resolution up to 1920*1080
multiple display triple
mechanical & environment
dimension 3.5'', 146*105mm
power input dc 9-28v
temperature operation: 0℃~60℃, storage: -25℃~75℃
relative humidity operation: 10%~90%, storage: 5%~95%, non-condensing
Tensilica首家采用Dolby MS10多码流解码器，
鸿蒙系统支持哪些机型
在流片前验证中如何测量功耗 执行功耗分析的步骤是什么
digilentPcam 5C开发板的成像模块介绍
router模式和ap模式是什么意思_有什么区别
信步科技SV3b-72026嵌入式主板介绍
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预计到2023年，ASML公司的EUV光刻机带来的收入将比2020年的收入翻一番
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工业4.0时代，增强现实技术如何变革制造业
英国宣布将放宽规划立法，简化建造存储可再生能源的大型蓄电池流程
Facebook开发出可自动生成食谱的AI系统
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AT组件的实现过程和代码的调用逻辑
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OPPO稳坐第一，华为不惧，小米很苦逼！