信步科技SV1-38526C嵌入式主板介绍
intel skylake-u celeron 3855u cpu, double-layer rear i/o which can expand to 18*com and 16*usb
intel skylake-u celeron 3855u cpu double-layer rear i/o which can expand to 18*com and 16*usb (use sv-m5 i/o extension modules) supports triple display of vga, hdm and lvds/edp 2*1000 mbps lan and 1*pci-e 4x 2*mini-pcie (support 1*msata, 1*wifi/3g/4g)
规格 general
cpu intel® skylake-u celeron® 3855u cpu, dual-core, 1.6 ghz, tdp 15w
chipset null
memory up to 8 gb ddr3l 1600/1333 mhz, 1*so-dimm
storage 1*sata 3.0, 1*msata
expansion interface 1*pci-e 16x (4x signal)
2*mini-pcie (1*msata supported, 1*wifi/3g/4g supported)
bios ami uefi bios
system windows7/8/10, linux
i/o interface
serial port 6*rs232 (up to 18*rs232 with sv-m5-cu)
usb 2*usb 3.0, 8*usb 2.0 (up to 16*usb with sv-m5-cu)
ethernet 2*realtek® pci-e lan for 1000mbps
audio realtek® alc662 5.1 channel hda codec, supports mic/line-out ports
ps/2 1*ps/2
parallel port null
gpio 8 programmable gpio
feature interface null
display
display interface 1*vga: max resolution up to 1920*1200@60hz
1*hdmi: max resolution up to 1920*1200@60hz
1*lvds/edp: lvds, dual channel 24 bit, max resolution up to 1920*1200@60hz
edp, max resolution up to 1920*1200@60hz
multiple display triple
mechanical & environment
dimension mini-itx, 170*170mm
power input atx psu or dc 12v
temperature operation: 0℃~60℃, storage: -25℃~75℃
relative humidity operation: 10%~90%, storage: 5%~95%, non-condensing
郭世婷表示东云将继续顺应新时代信息服务发展新需求
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智能家居的两块绊脚石，用户体验和安全漏洞问题
嵌入式软件驱动的硬件验证
信步科技SV1-38526C嵌入式主板介绍
电控成套设备的二次布线工艺
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intel skylake-u celeron 3855u cpu double-layer rear i/o which can expand to 18*com and 16*usb (use sv-m5 i/o extension modules) supports triple display of vga, hdm and lvds/edp 2*1000 mbps lan and 1*pci-e 4x 2*mini-pcie (support 1*msata, 1*wifi/3g/4g)
规格 general
cpu intel® skylake-u celeron® 3855u cpu, dual-core, 1.6 ghz, tdp 15w
chipset null
memory up to 8 gb ddr3l 1600/1333 mhz, 1*so-dimm
storage 1*sata 3.0, 1*msata
expansion interface 1*pci-e 16x (4x signal)
2*mini-pcie (1*msata supported, 1*wifi/3g/4g supported)
bios ami uefi bios
system windows7/8/10, linux
i/o interface
serial port 6*rs232 (up to 18*rs232 with sv-m5-cu)
usb 2*usb 3.0, 8*usb 2.0 (up to 16*usb with sv-m5-cu)
ethernet 2*realtek® pci-e lan for 1000mbps
audio realtek® alc662 5.1 channel hda codec, supports mic/line-out ports
ps/2 1*ps/2
parallel port null
gpio 8 programmable gpio
feature interface null
display
display interface 1*vga: max resolution up to 1920*1200@60hz
1*hdmi: max resolution up to 1920*1200@60hz
1*lvds/edp: lvds, dual channel 24 bit, max resolution up to 1920*1200@60hz
edp, max resolution up to 1920*1200@60hz
multiple display triple
mechanical & environment
dimension mini-itx, 170*170mm
power input atx psu or dc 12v
temperature operation: 0℃~60℃, storage: -25℃~75℃
relative humidity operation: 10%~90%, storage: 5%~95%, non-condensing
郭世婷表示东云将继续顺应新时代信息服务发展新需求
浅析基于智能矿山电力监控系统应用方法
ph计电极保护液是什么_ph计电极保护液怎么配_酸度计电极保护液配置
智能家居的两块绊脚石，用户体验和安全漏洞问题
嵌入式软件驱动的硬件验证
信步科技SV1-38526C嵌入式主板介绍
电控成套设备的二次布线工艺
3D集成系统的测试挑战
基于可拉伸、自卷曲微流控电子器件的高适形性神经接口开发
选择二手iPhone6s，还是同价位小米6更划算？
选择好的云主机需了解哪些关键因素？
全球最大屏幕讯号线制造商翻转3次倒闭命运的奇迹
Tensilica与Express Logic共同宣布Thr
Altera以太网路IP核心 降低FPGA设计难度
J-Scope支持的设备
索尼发布史上最小电影摄像机FX3
有机会重回五五开：AMD份额一个季度暴涨50%狂追Intel
支持内存类型
华菱湘钢完成了我国钢铁业首次“5G+AR跨国远程装配”
电气图的识图步骤